News
Holdson is pleased to announce its return to Industrial Transformation ASIA-PACIFIC (ITAP), taking place from 15th-17th October in Singapore. As a leading provider of electrochemical polishing systems for complex metal components, Holdson will be showcasing its patented electroform® technology to manufacturers and partners across the APAC region.
Following a successful debut at ITAP 2024, and recognition as a Top 10 finalist in the Slingshot startup competition, Holdson continues to expand its international footprint, supporting customers across aerospace, energy, medical and precision engineering sectors.
Neil Dickinson, CRO and Co-Founder, pitching at SWITCH Slingshot competition in 2024.
At this year’s event, the team will highlight how electroform® offers a scalable, non-contact alternative to traditional finishing methods. With proven results on advanced alloys including tungsten, Inconel, titanium and stainless steel, the system delivers measurable improvements in surface quality, part consistency and cost-per-part without compromising geometry or material integrity.
Visitors can learn more about:
The latest advancements in Holdson’s machine platforms and AI-driven software
How electroform® supports post-processing for additive, cast and forged parts
Plans for Holdson’s upcoming Singapore polishing and support hub
Holdson’s Co-Founder and Chief Revenue Officer, Neil Dickinson, will be attending ITAP and is available for in-person meetings throughout the week.
To pre-arrange a meeting or learn more, contact neil@holdson.co.uk
HOLDSON LIMITED
Unit 6, Pennine Court, Standback Way, Skelmanthorpe, Huddersfield, HD8 9GA
